Flexible application of hybrid assembly technology: key to customized PCB solutions

NEW CHIP07/01/2024102

With the continuous advancement of electronic technology, hybrid assembly technology, as a combination of surface mount (SMT) and plug-in assembly (THT) methods, provides designers with greater flexibility, allowing them to customize PCB solutions according to specific needs. This article will delve into the principles, advantages, and application areas of hybrid assembly technology, revealing its key role in electronic manufacturing.


The principle of hybrid assembly technology:

Hybrid assembly technology combines two different assembly methods, SMT and THT, to achieve high customization of circuit boards by simultaneously using surface mount components and plug-in components on the same PCB. This technology can meet the advantages and characteristic requirements of different components, providing more flexible design space.

The advantages of hybrid assembly technology:


 Allow the simultaneous use of small SMT components and large THT components to meet the requirements of different sizes and shapes of components.

Performance optimization:

 The most suitable assembly method can be used on the PCB to optimize circuit performance and improve overall reliability.

Cost effectiveness: 

Avoiding the cost of using expensive SMT or THT methods for the entire circuit board and reducing manufacturing costs.

Design Freedom: 

Designers can freely choose the layout and arrangement of components to meet specific application requirements.

Application areas of hybrid assembly technology:

Medical electronics: 

In medical devices, it may be necessary to combine components such as miniature sensors (SMT) and large connectors (THT) to meet the requirements of complex medical electronic systems.

Industrial automation:

 For industrial automation applications that require high-performance processors (SMT) and industrial grade connectors (THT), hybrid assembly technology provides an ideal solution.

Communication equipment: 

In communication equipment, it may be necessary to combine high-frequency RF components (SMT) and high-power power supplies (THT) to meet the requirements of communication modules.

The emergence of hybrid assembly technology provides designers with more choices, enabling them to better balance the needs of different components and improve the performance and reliability of PCBs. In future electronic manufacturing, hybrid assembly technology is expected to become a key method for achieving personalized and customized PCB solutions, driving the entire industry towards more flexible and innovative directions.

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